Solvent-free compounding machine is a method of compounding two or more substrates with solvent-free adhesive, also known as reactive compounding. Solvent-free compounding has a wide range of applications. Its environmental protection, hygiene and high efficiency are especially suitable for the food and drug packaging industry. The composable substrates mainly include BOPP,PET,Nylon,CPP,PE,VMPET,VMCPP,PVC, aluminum foil, paper, etc. The applicable thickness of the substrate is generally 7um-120um.